400 tie point interlocking solderless breadboard

About this product

Half-size solderless breadboard with 400 tie points for small to medium prototyping. Contains 30 columns of 5 interconnected pins plus two independent power rails. Includes interlocking tabs for modular expansion and a self-adhesive backing for mounting.

Breadboards, jumper wires, perf boards and prototyping accessories for fast bench builds.

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Specifications

Total Tie Points

400

Terminal Pins

300 (2 x 30 x 5)

Power Rails

2 (100 tie points total)

Contact Material

Nickel-plated phosphor bronze

Housing Material

ABS plastic

Wire Gauge

20-29 AWG solid wire

Pitch

2.54 mm (0.1")

Dimensions

82 x 55 x 8.5 mm